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Industrial solution

Photovoltaics

From wafer intake through to module EL inspection.

Photovoltaics — representative inspection subject

Defect detection in cells and modules bears directly on yield. Conventional algorithms handle a single defect type well but generalise poorly to compound defects that vary in shape and scale. DSTEK detects them automatically in electroluminescence imagery, and supplies the wafer loading and unloading automation alongside.

Scope

What we inspect

  • Wafer intake

    Size, saw marks, bow, breakage, micro-cracks and contamination; breakage, overlap and angle during basket insertion

  • Post-PECVD

    Coating colour variation and surface defects — white spots, contamination, intra- and inter-cell colour difference, edge bow, etch marks

  • Screen printing

    Grid breaks, print offset, line width, back-field delamination, paste leakage

  • PL / EL

    Back-film contamination and suction marks, front-film scratches and white spots, post-print micro-cracks

  • Module EL

    Linear and cross micro-cracks, black corners, black spots

  • Wafer handling

    Loading and unloading automation; breakage, overlap and angle on basket insertion

Applications

Representative inspection tasks

A selection of what we have actually run on the line — not the full list. New inspection targets are approached the same way.

  • Mono/poly wafer inspection

    Size, saw marks, bow, breakage, micro-cracks, contamination

  • Vertical basket inspection

    Fragments, wrong wafers, overlapped or thick wafers, insertion imbalance (height difference over 20mm)

  • PECVD coating inspection

    White spots, contamination, intra-cell and overall colour difference, edge bow, etch marks

  • SE electrode cell inspection

    Two-dimensional reference deviation of ±15μm

  • Screen print inspection

    Grid breaks, print offset, line width, back-field delamination, back-electrode offset, paste leakage

  • Cell colour sorting

    Crystalline silicon colour depth and distribution, sorted into 8–24 trays

  • Junction box laser welding

    Weld head guidance, busbar flatness inspection, post-weld quality inspection

  • Module string welding EL

    Linear and cross micro-cracks, black corners and spots

  • Automatic wafer loading/unloading

    Solar wafer loading and unloading line automation

Inspection imagery

What the system sees

  • Cell EL micro-crack detection Cell EL micro-crack detection
  • Module EL black spot detection Module EL black spot detection
  • Monocrystalline module EL Monocrystalline module EL
  • Polycrystalline cell EL Polycrystalline cell EL

Our edge

What we bring to this industry

  • 01 Deep-learning models built specifically for EL and PL imagery
  • 02 Precision measurement to a ±15μm reference
  • 03 Inspection and wafer handling automation supplied as one line

Tell us the inspection problem. We will start by telling you whether it is solvable.

Contact us