Industrial solution

Semiconductor & Substrates

Wafer, package and bonding through to PCBA, FPC and FC-BGA.

Semiconductor packaging is fine-pitch work with complex defect modes, so inspection has to be both precise and fast. Substrates keep shrinking and densifying, and conventional AOI can no longer hold down over- and under-detection. DSTEK combines 2D/3D imaging, multi-colour multi-angle strobe capture and a PCB-specific industrial AI model to cover everything from the wafer to the assembled board.

Over 50Compatible product types
1μmMeasurement precision
20+FPC defect types

Scope

What we inspect

Wafer

Bump height, diameter, pitch and coplanarity; surface scratches, contamination and foreign matter
BGA / QFP / QFN

Solder ball height, pitch and coplanarity; missing balls, cracks, bridging; lead skew and coplanarity
Wire bonding

Wire and pad offset, loop faults, sagging, lifting; bridging, missing and double bonds
PCBA

Insufficient and excess solder, bridging, cold joints and voids quantified at pixel level; wrong, missing and reversed parts
FPC / FPCA

Creases, folds, gold-finger curvature, plating bridges, exposed copper, tears — 20+ defect types
FC-BGA

Contamination, scratches, pits, bubbles, white spots and hole defects; ring width and bonding pad dimensions

Applications

Representative inspection tasks

A selection of what we have actually run on the line — not the full list. New inspection targets are approached the same way.

Wafer appearance inspection

Dicing anomalies, pad protrusion, defects and scratches, edge damage, delamination, chip residue, emitting-area defects
Chip appearance and dimensions

Contamination, spots, damage, corner defects, foreign matter, missing parts, misalignment, counting
SMT solder joint inspection

Insufficient solder, excess solder, bridging and shorts, cold joints, voids
Lead frame inspection

QFN plated silver and copper surfaces — staining, yellowing, discolouration, silver leakage, under- and over-etching
Capacitor inspection

Polarity reversal, mixed capacitance, unclear sleeve marking, aluminium case deformation
MLCC appearance inspection

Six-sided cracks, chipping, contamination and electrode defects
Inductor six-sided AOI

Dents, cracks, warping, gaps, contamination, grit, burrs, bubbles, colour non-uniformity
LED lamp bead inspection

Excess and insufficient adhesive, bubbles, cracks and scratches on the bond line, pin deformation and absence
Precision resistor inspection

Base contamination, silver leakage, insufficient silver on the top face
Connector appearance inspection

Male and female connector solder defects and joint offset

Global semiconductor and component manufacturer