Industrial solution
Display
From glass edges to OLED FPC, across the display process chain.
Display work sets three different optical problems: fine edge defects on large-format glass, the extreme fragility of foldable UTG, and the layered structure of OLED FPC. DSTEK holds both large-format line-scan inspection and multilayer substrate algorithms, so inspection can be staged from first glass processing through to module shipment.
Scope
What we inspect
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Large-format glass edge
Edge cracks and chipping, captured with 4K line scan plus close-up optics at single-pixel precision
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UTG and foldable glass
Post-cutting edge defects on ultra-thin glass, integrated with articulated-robot handling
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Cover glass
Scratches, foreign matter, dents and polishing marks on tempered and 2.5D curved covers
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OLED and display FPC
PI residue, adhesive residue, plating bridges, folds, creases, exposed copper, tears, gold-finger curvature
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Display IC bonding
Wire offset, sagging, crowning, bridging, omission and double bonds; pad and gold-finger damage
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Module codes and text
OCR, barcode and QR reading with label conformity verification
Applications
Representative inspection tasks
A selection of what we have actually run on the line — not the full list. New inspection targets are approached the same way.
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Large-format glass edge inspection
4K line-scan cameras with close-up rings detect edge cracks and chipping on large glass, imaging at around 0.01mm per pixel.
Large-format display glass
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UTG foldable glass inspection
Ultra-thin glass is inspected for edge defects while being handled by articulated robots after cutting, with tray-to-jig transfer automated alongside.
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Cover glass inspection
Scratches, foreign matter, dents and polishing marks on tempered and 2.5D curved covers, using optics designed for curvature.
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OLED FPC inspection
Detects 13+ defect types including PI residue, adhesive residue, plating bridges, folds and creases, exposed copper, tears and gold-finger curvature.
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Mobile and laptop FPC inspection
Appearance and attachment state judged together across multilayer flexible circuits, before and after assembly.
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Display IC wire bonding
Bonding wires, pads, gold fingers and components checked for offset, sagging, crowning, bridging, omission and double bonds.
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Inductor six-sided AOI
A vibratory feeder and glass disc present all six faces for capture, judging exposed copper, breakage and cracks. Applied to power components.
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Module OCR and code reading
Characters, barcodes and QR codes on display modules are read and checked for label conformity.
Our edge
What we bring to this industry
- 01 Edge-specific optics combining large-format line scan with close-up imaging
- 02 Lighting designed for ultra-thin and curved glass
- 03 Defect models built specifically for multilayer flexible circuits
- 04 Inspection and robot handling supplied as one line
Other industries
Explore the other industries we serve
What runs this inspection